Webinars
Beyond Monolithic: The Promising Future Of Multi-die Semiconductors And Chiplets
Industrial Equipment
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With the burgeoning need for high computational power, local (edge) data processing, and Moore’s Law reaching its limits, the semiconductor domain is undergoing transformational changes. These changes encompass new fabrication and process node technologies, novel transistor designs, exploration of 2D nano materials, and advanced packaging technologies such as Multi-die Semiconductors.
Multi-die semiconductor packaging technology, often referred to as chiplet packaging, has gained prominence due to several key enablers and driving factors, such as enhanced performance, cost efficiency, and flexibility in semiconductor design and manufacturing. It leverages advances in manufacturing processes, design methodologies, and market demands to enable the creation of more powerful and efficient electronic devices.
Chiplet packaging technology has gained traction in the semiconductor industry, especially in high-performance computing, data centers, and certain specialized applications (defense and aerospace). However, the adoption rate has gradually expanded to other industries as well. A recent example is the custom-designed M1 chip by Apple for their portable computers. Furthermore, the technology is poised to see adoption in mobility and allied industries, primarily driven by the need for edge computing for machine learning and autonomous control tasks in safety-critical applications.
FutureBridge’s semiconductor analysts will delve deeper into the realm of chiplet packaging technology, highlighting its implications for various industries and applications. The upcoming webinar will touch upon the driving factors behind this technology, key solutions, and the key players in this area. In addition, the webinar will also shed light on emerging trends surrounding photonic integrated circuits (PIC) and quantum computing, as well as their integration aspects with chiplet technology.
This webinar offers valuable insights into gaining a holistic understanding of multi-die semiconductors. It encompasses their technological evolution, real-world applications, and the influential stakeholders shaping the future of this field.
The webinar will cover and address the following aspects and questions around the topic:
- What does chiplet packaging technology encompass, and how does it relate to various semiconductor architectures?
- What are the driving forces and enabling factors behind chiplet packaging technology?
- Impacts and benefits of integrating this packaging technology with allied technologies such as PICs, quantum computing, etc.
- Critical benefits and challenges when comparing multi-die semiconductors to traditional single-die chips in terms of construction, capabilities, specifications, and applications.
- Real-world examples and case studies showcasing recent commercial product examples and success stories
- Key entities in this area (start-ups, research institutes, etc.) and their strategic quests (partnerships, investments, etc.)
- Emerging trends, challenges (such as power consumption), and prerequisites of multi-die systems
- Future Roadmap & way forward
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